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FCX591 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # FCX591
Description  60V PNP MEDIUM POWER TRANSISTOR IN SOT89
PDF  7 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

FCX591 Datasheet(HTML) 2 Page - Diodes Incorporated

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FCX591
Datasheet Number: DS33061 Rev. 4 - 2
2 of 7
www.diodes.com
February 2014
© Diodes Incorporated
FCX591
A Product Line of
Diodes Incorporated
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Limit
Unit
Collector-Base Voltage
VCBO
-80
V
Collector-Emitter Voltage
VCEO
-60
V
Emitter-Base Voltage
VEBO
-7
V
Continuous Collector Current
IC
-1
A
Peak Pulse Current
ICM
-2
A
Base Current
IB
-200
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 5)
PD
1
W
(Note 6)
1.5
(Note 7)
2.0
Thermal Resistance, Junction to Ambient Air
(Note 5)
RθJA
125
°C/W
(Note 6)
83
(Note 7)
60
Thermal Resistance, Junction to Lead
(Note 8)
RθJL
22
Thermal Resistance, Junction to Case
(Note 9)
RθJC
16
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
ESD Ratings (Note 10)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
400
V
C
Notes:
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Thermal resistance from junction to the top of the case.
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.



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