W158

Rev 1.0, November 21, 2006

Page 7 of 12

Stresses greater than those listed in this table may cause

permanent damage to the device. These represent a stress

rating only. Operation of the device at these or any other condi-

tions above those specified in the operating sections of this

specification is not implied. Maximum conditions for extended

periods may affect reliability.

.

Parameter

Description

Rating

Unit

Voltage on any pin with respect to GND

–0.5 to +7.0

V

Storage Temperature

–65 to +150

°C

Operating Temperature

0 to +70

°C

Ambient Temperature under Bias

–55 to +125

°C

Input ESD Protection

2 (min.)

kV

Parameter

Description

Test Condition

Min.

Typ.

Max.

Unit

Supply Current

Combined 3.3V Supply Current

160

mA

Combined 2.5V Supply Current

90

mA

Input Low Voltage

GND

–0.3

0.8

V

Input High Voltage

2.0

VDD+

0.3

V

–25

µA

10

µA

–5

µA

5µA

Clock Outputs

Test Condition

Min.

Typ.

Max.

Unit

Output Low Voltage

50

mV

Output High Voltage

2.2

V

Output Low Current

45

65

100

mA

Output High Current

45

65

100

mA

Test Condition

Min.

Typ.

Max.

Unit

Output Low Voltage

50

mV

Output High Voltage

3.1

V

Output Low Current

45

65

100

mA

Output High Current

45

65

100

mA

Test Condition

Min.

Typ.

Max.

Unit

Output Low Voltage

50

mV

Output High Voltage

3.1

V

Output Low Current

70

100

145

mA

Output High Current

65

95

135

mA

Notes:

29. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.

30. All clock outputs loaded with 6" 60

transmission lines with 20-pF capacitors.

31. W158 logic inputs have internal pull-up devices, except SEL133/100# (pull-ups not CMOS level).