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HCTS164K Datasheet(PDF) 7 Page - Intersil Corporation |
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HCTS164K Datasheet(HTML) 7 Page - Intersil Corporation |
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7 / 8 page  7 HCTS164MS Metallization Mask Layout HCTS164MS DS1 DS2 Q0 (3) Q1 (4) (5) (6) (7) VCC Q7 Q6 (11) Q5 (10) Q4 (9) (8) NC NC (2) (1) (14) (13) (12) (MR) CP GND Q3 Q2 Spec Number 518613 Die Characteristics DIE DIMENSIONS: 95 mils x 95 mils 2.380mm x 2.410mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ±2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils |
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