Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (V

−0.3V to +6V

Input Voltage (R

−0.3V to (V

Output Voltage (R

−0.3V to (V

M Package

1025 mW

Derate M Package

8.2 mW/˚C above

+25˚C

Storage Temperature Range

−65˚C to +150˚C

Lead Temperature Range

Soldering (4 sec.)

+260˚C

Maximum Junction Temperature

+150˚C

ESD Rating (Note 4)

(HBM, 1.5 k

Ω, 100 pF)

≥ 3,500V

(EIAJ, 0

Ω, 200 pF)

≥ 250V

Recommended Operating

Conditions

Min

Typ

Max

Units

Supply Voltage (V

+4.5

+5.0

+5.5

V

Receiver Input Voltage

GND

2.4

V

Operating Free Air

Temperature (T

−40

+25

+85

˚C

Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)

Symbol

Parameter

Conditions

Pin

Min

Typ

Max

Units

V

TH

Differential Input High Threshold

V

R

R

IN−

+100

mV

V

TL

Differential Input Low Threshold

−100

mV

I

IN

Input Current

V

V

−10

+10

µA

V

−10

+10

µA

V

OH

Output High Voltage

I

R

OUT

3.8

4.9

V

I

3.8

4.9

V

I

3.8

4.9

V

I

4.9

V

V

OL

Output Low Voltage

I

0.07

0.3

V

I

OS

Output Short Circuit Current

V

−15

−60

−100

mA

I

CC

No Load Supply Current

Inputs Open

V

CC

3.5

10

mA

Switching Characteristics

V

Symbol

Parameter

Conditions

Min

Typ

Max

Units

t

PHLD

Differential Propagation Delay High to Low

C

V

(Figure 1 and Figure 2)

1.0

3.40

6.0

ns

t

PLHD

Differential Propagation Delay Low to High

1.0

3.48

6.0

ns

t

SKD

Differential Skew |t

0

0.08

1.2

ns

t

SK1

Channel-to-Channel Skew (Note 5)

0

0.6

1.5

ns

t

SK2

Chip to Chip Skew (Note 6)

5.0

ns

t

TLH

Rise Time

0.5

2.5

ns

t

THL

Fall Time

0.5

2.5

ns

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