INTEGRATED CIRCUITS DIVISION

www.littelfuse.com

4

R06

FDA217

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Littelfuse classifies

its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry

standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to

the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled

according to the limitations and information in that standard as well as to any limitations set forth in the information or

standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Classification

FDA217S

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (T

c) and the maximum dwell

time (t

p) the body temperature of these surface mount devices may be (Tc - 5)°C or greater. The Classification

Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.

Device

Classification Temperature (T

c)

Dwell Time (t

P)

Max Reflow Cycles

FDA217S

250ºC

30 seconds

3

For through-hole devices, the wave soldering maximum lead (pin) temperature and the maximum dwell time the

leads (pins) are at the peak soldering temperature is given in the table below. Maximum wave soldering parameters

are shown below.

Device

Pin Temperature

Body Temperature

Dwell Time

Wave Cycles

FDA217

260ºC

250ºC

10 seconds

1

Board Wash

Littelfuse recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue

following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the

device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake

cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability

of the wash parameters used to clean the board, determination of the bake temperature and duration necessary

to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying

methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must

not be exposed to halide flux or solvents.