RY8411

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©RYCHIP Semiconductor Inc.

Standoff 42V 1.2A 800KHz Sync Step-Down Regulator

Page 13 / 13

Package Description

TOP VIEW

RECOMMENDED PAD LAYOUT

FRONT VIEW

SIDE VIEW

AAAAA

2.80

3.00

1.50

1.70

2.60

3.00

PIN 1

EXAMPLE

TOP MARK

1.20

TYP

0.60

TYP

0.95

BSC

2.60

TYP

0.90

1.30

0.30

0.50

0.95 BSC

1.45 MAX

0.00

0.15

SEATING PLANE

0.09

0.20

AAAAA

2.80

3.00

1.50

1.70

2.60

3.00

PIN 1

EXAMPLE

TOP MARK

1.20

TYP

0.60

TYP

0.95

BSC

2.60

TYP

0.90

1.30

0.30

0.50

0.95 BSC

1.45 MAX

0.00

0.15

SEATING PLANE

0.09

0.20

NOTE:

1. CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS IN MILLIMETERS.

2. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

3. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

4. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.004" INCHES MAX.

5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.

6. DRAWING IS NOT TO SCALE.

AAAAA

2.80

3.00

1.50

1.70

2.60

3.00

PIN 1

EXAMPLE

TOP MARK

1.20

TYP

0.60

TYP

0.95

BSC

2.60

TYP

0.90

1.30

0.30

0.50

0.95 BSC

1.45 MAX

0.00

0.15

SEATING PLANE

0.09

0.20

NOTE:

1. CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS IN MILLIMETERS.

2. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

3. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

4. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.004" INCHES MAX.

5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.

6. DRAWING IS NOT TO SCALE.

SOT23-6

GAUGE PLANE

0.25 BSC

0.30

0.55

0°~8°