RS+, RS- to GND....................................................-0.3V to +6V

OUT to GND............................................ -0.3V to (VRS+ +0.3)V

RS+ to RS- ..............................................................-0.3V to +6V

Short-Circuit Duration (OUT to Any Other Pins) .......Continuous

Continuous Input Current (Any Pin) .................................±20mA

Continuous Power Dissipation (TA = +70°C)

WLP (derate 9.7mW/°C above +70°C)........................776mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

WLP

Junction-to-Ambient Thermal Resistance (θJA) ........103°C/W

(Note 1)

(VRS+ = VRS- = 3.6V, VSENSE = 0V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Current

IS

TA = +25°C

12.5

17

µA

-40°C < TA < +125°C

20

Common-Mode Input Range

VCM

Guaranteed by CMRR,

-40°C < TA < +125°C

1.8

5.5

V

Guaranteed by CMRR,

-40°C < TA < +85°C

1.6

5.5

Common-Mode Rejection Ratio/

Power-Supply Rejection Ratio

CMRR,

PSRR

1.8V < VRS+ < 5.5V,

VSENSE = 10mV

120

100

dB

1.6V < VRS+ < 5.5V, -40°C < TA < +85°C,

VSENSE = 10mV

120

100

Input Offset Voltage (Note 3)

VOS

TA = +25°C

7

30

µV

-40°C < TA < +125°C

50

Input Offset Voltage Drift

(Note 3)

TCVOS

40

300

nV/°C

Gain

G

MAX44286T

25

V/V

MAX44286F

50

MAX44286H

100

MAX44286W

200

Gain Error (Note 4)

GE

TA = +25°C

0.1

0.23

%

-40°C < TA < +125°C

0.25

Input Bias Current RS-

IRS-

0.02

1

nA

Capacitive Loading

CL

No sustained oscillations

400

pF

OUT Low Voltage

VOL

Sink current = 300µA

30

65

mV

Sink current = 0µA

3

15

MAX44286

Low-Power, Precision, 4-Bump WLP,

Current-Sense Amplifier

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics