MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Note: 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.

2.P.C.B. mounted with 0.2x0.2 ”(5.0x5.0mm) copper pad areas

Ratings at 25 C ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

VOLTS

VOLTS

VOLTS

SYMBOLS

UNITS

Amps

Amps

Volts

VRRM

VRMS

VDC

I(AV)

IFSM

VF

8.0

180.0

0.60

Operating junction temperature range

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

at TL(see fig.1)

Peak forward surge current

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

Maximum instantaneous forward voltage at 8.0A

Maximum DC reverse current

TA=25 C

at rated DC blocking voltage

TA=100 C

Typical junction capacitance (NOTE 1)

IR

0.3

R

θJA

CJ

TJ,

TSTG

50.0

200

pF

C

mA

Typical thermal resistance (NOTE 2)

C/W

Storage temperature range

C

-50 to +150

-50 to +150

-50 to +175

20

10

0.45

0.70

SS82L SS83L

SS85L

SS84L

SS86L

SS810L

SS88L

20

14

20

30

21

30

40

28

40

50

35

50

60

42

60

80

56

80

100

70

100

SS815L

150

105

150

SS820L

200

150

200

0.85

0.2

2.0

MDD Catalog Number

www.shunyegroup.com.cn

V2.22

LOW VF SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

SS82L THRU SS820L

Dimensions in inches and (millimeters)

0.280(7.11)

0.260(6.60)

0.245(6.22)

0.220(5.59)

DO-214AB/SMC

0.126 (3.20)

0.114 (2.90)

0.060(1.52)

0.030(0.76)

0.320(8.13)

0.305(7.75)

0.012(0.305)

0.006(0.152)

0.008(0.203)MAX.

0.103(2.62)

0.079(2.06)

FEATURES

MECHANICAL DATA

Case: JEDEC DO-214AB molded plastic body

Terminals: Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight:0.007 ounce, 0.25 grams

The plastic package carries Underwriters Laboratory

Flammability Classification 94V-0

For surface mounted applications

Metal silicon junction,majority carrier conduction

Low power loss,high efficiency

Built-in strain relief,ideal for automated placement

High forward surge current capability

High temperature soldering guaranteed:

260 C/10 seconds at terminals