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SS810 Datasheet(PDF) 1 Page - Shanghai Shunye Electronics Co.,Ltd. |
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SS810 Datasheet(HTML) 1 Page - Shanghai Shunye Electronics Co.,Ltd. |
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1 / 3 page ![]() MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Note: 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2 ”(5.0x5.0mm) copper pad areas Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. VOLTS VOLTS VOLTS SYMBOLS UNITS Amps Amps Volts VRRM VRMS VDC I(AV) IFSM VF 8.0 180.0 0.70 Operating junction temperature range Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) IR 0.5 R θJA CJ TJ, TSTG 50.0 200 pF C mA Typical thermal resistance (NOTE 2) C/W Storage temperature range C -50 to +150 -50 to +150 -50 to +175 20 10 0.55 0.85 SS82 SS83 SS85 SS84 SS86 SS810 SS88 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 SS815 150 105 150 SS820 200 150 200 0.95 0.2 2.0 MDD Catalog Number www.shunyegroup.com.cn V2.22 SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER SS82 THRU SS820 Dimensions in inches and (millimeters) 0.280(7.11) 0.260(6.60) 0.245(6.22) 0.220(5.59) DO-214AB/SMC 0.126 (3.20) 0.114 (2.90) 0.060(1.52) 0.030(0.76) 0.320(8.13) 0.305(7.75) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.103(2.62) 0.079(2.06) FEATURES MECHANICAL DATA Case: JEDEC DO-214AB molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight:0.007 ounce, 0.25 grams The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Metal silicon junction,majority carrier conduction Low power loss,high efficiency Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 260 C/10 seconds at terminals |
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