© 2002 Fairchild Semiconductor Corporation

www.fairchildsemi.com

KA79XX / KA79XXA / LM79XX Rev. 1.1.1

2

Block Diagram

Figure 1. Block Diagram

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.

Notes:

1. Thermal resistance test board, size: 76.2 mm x 114.3 mm x 1.6 mm(1S0P), JEDEC standard:

JESD51-3, JESD51-7.

2. Assume no ambient airflow.

Symbol

Parameter

Value

Unit

VI

Input Voltage

-35

V

RθJC

Thermal Resistance, Junction-Case(1)

5

°C/W

RθJA

Thermal Resistance, Junction-Air(1, 2)

65

°C/W

TOPR

Operating Temperature Range

0 to +125

°C

TSTG

Storage Temperature Range

- 65 to +150

°C

VOLTAGE

REFERENCE

+

-

PROTECTION

CIRCUITRY

R1

R2

Rsc

GND

I1

I2

Out

In

Q1

Q2

Output

Input