TMS320DM643 datasheet(156/162 Pages) TI

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7.2 Packaging Information

TMS320DM643

Video/Imaging Fixed-Point Digital Signal Processor

SPRS269C – FEBRUARY 2005 – REVISED JANUARY 2007

Table 7-3. Thermal Resistance Characteristics (S-PBGA Package) [ZDK] (continued)

NO.

°C/W

AIR FLOW (m/s)(1)

18.2

0.00

15.3

0.5

Junction-to-free air

13.7

1.0

12.2

2.00

0.37

0.00

0.47

0.5

PsiJT

Junction-to-package top

0.57

1.0

0.7

2.00

11.4

0.00

0.5

PsiJB

Junction-to-board

10.7

1.0

10.2

2.00

Table 7-4. Thermal Resistance Characteristics (S-PBGA Package) [ZNZ]

NO.

°C/W

AIR FLOW (m/s)

Junction-to-case

3.3

N/A

Junction-to-board

7.46

N/A

17.4

0.00

14.0

0.5

Junction-to-free air

12.3

1.0

10.8

2.00

0.37

0.00

0.47

0.5

PsiJT

Junction-to-package top

0.57

1.0

0.7

2.00

11.4

0.00

0.5

PsiJB

Junction-to-board

10.7

1.0

10.2

2.00

The following packaging information and addendum reflect the most current released data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

Mechanical Data

156

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