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AP85N04DF Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP85N04DF Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP85N04DF 40V N-Channel Enhancement Mode MOSFET AP85N04DF REV1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 40 - - V lGSS Gate-body Leakage Current VDS = 0V, VGS = ±20V - - ±100 nA IDSS TJ=25°C Zero Gate Voltage Drain Current VDS = 40V, VGS = 0V - - 1 μA IDSS TJ=100°C - - 100 VGS(th) Gate-Threshold Voltage VDS=VGS, ID= 250µA 1.2 1.7 2.2 V RDS(on) Drain-Source On-Resistance4 VGS=10V, ID=20A - 2.1 2.8 mΩ VGS=4.5V, ID=15A - 2.8 3.8 gfs Forward Transconductance4 VDS=10V, ID=20A - 75 - S Ciss Input Capacitance VDS=20V, VGS=0V, f=1MHz - 2625 - pF Coss Output Capacitance - 560 - Crss Reverse Transfer Capacitance - 35 - RG Gate Resistance f=1MHz - 1 - Ω Qg Total Gate Charge VGS=10V, VDS=20V, ID=20A - 42.6 - nC Qgs Gate-Source Charge - 6.6 - Qgd Gate-Drain Charge - 7.2 - td(on) Turn-on Delay Time VGS=10V, VDD=20V, RG=3Ω, ID=20A - 9.8 - ns tr Rise Time - 8.7 - td(off) Turn-off Delay Time - 30.8 - tf Fall Time - 10.4 - trr Body Diode Reverse Recovery Time IF=20A , dI/dt=100A/μs - 46 - ns Qrr Body Diode Reverse Recovery Charge - 18.4 - nC VSD Diode Forward Voltage4 IS=20A, VGS=0V - - 1.2 V IS Continuous Source Current TC=25°C - - 85 A Note : 1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is VDD =32V,VGS =10V,L=0.1mH,IAS =54A 4、The power dissipation is limited by 150℃ junction temperature 5、The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation. |
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