5/19

M40SZ100Y, M40SZ100W

Figure 7. Hardware Hookup

Note: 1. User supplied for the 16-pin package

MAXIMUM RATING

Stressing the device above the rating listed in the

“Absolute Maximum Ratings” table may cause

permanent damage to the device. These are

stress ratings only and operation of the device at

these or any other conditions above those indicat-

ed in the Operating sections of this specification is

not implied. Exposure to Absolute Maximum Rat-

ing conditions for extended periods may affect de-

vice

reliability.

Refer

also

to

the

STMicroelectronics SURE Program and other rel-

evant quality documents.

Table 2. Absolute Maximum Ratings

Note: 1. Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 to 120

seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.

CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

AI04767

VCC

E

ECON

VSS

VOUT

VCC

1Mb or 4Mb

LPSRAM

3.0V, 3.3V or 5V

PFI

0.1

µF

0.1

µF

M40SZ100Y

M40SZ100W

E

PFO

RST

BL

To Microprocessor Reset

To Battery Monitor Circuit

Unregulated

Voltage

Regulator

VCC

VIN

R1

R2

From Microprocessor

RSTIN

VBAT

(1)

To Microprocessor NMI

Symbol

Parameter

Value

Unit

SNAPHAT

–40 to 85

°C

SOIC

–55 to 125

°C

(1)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

V

Supply Voltage

M40SZ100Y

–0.3 to 7

V

M40SZ100W

–0.3 to 4.6

V

Output Current

20

mA

Power Dissipation

1

W