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AP22804 Datasheet(PDF) 13 Page - Diodes Incorporated |
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AP22804 Datasheet(HTML) 13 Page - Diodes Incorporated |
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13 / 19 page ![]() AP22804 / AP22814 Document number: DS39137 Rev. 1 - 2 13 of 19 www.diodes.com November 2016 © Diodes Incorporated AP22804 / AP22814 Application Information Input and Output Capacitors It is needed to place a 1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device. Placing a high-value capacitor (10μF or 47μF) close to input pin is also recommended when the output transient load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Connect a minimum 100μF low ESR electrolytic or tantalum capacitor (or 10μF MLCC) between OUT and GND is also needed for hot-plug applications. It’s a must to bypass the output with a 0.1μF ceramic capacitor which improves the immunity of the device to short-circuit transients. The Bulky 100μF or larger capacitors help to reduce output droop voltage when a device is plugged in. When abnormal short-circuit condition happens, these capacitors can also reduce output negative voltage due to parasitic inductive effect and avoid device damage. Please note without the bypass capacitors, an output short may cause ringing on the input; if the voltage is over the maximum voltage rating, it will destroy the internal control circuitry even the duration is short. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 6ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 6ms deglitch timeout. The AP22804/AP22814 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP22804/AP22814 senses the short circuit and immediately clamps output current to a certain safe level. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches into current limiting mode and the current is clamped at ILIMIT, or ISHORT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22804/AP22814 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP22804/AP22814 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +35°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 6ms deglitch. ON/OFF Input Operator The EN input allows the output current to be switched on and off using a GPIO compatible input. The high signal (switch on) should be at least 1.5V, and the low signal (switch off) no higher than 0.65V. This pin should NOT be left floating. It is advisable to hold the EN signal low when applying or removing power. Under-voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. |
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