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LM2672 Datasheet(PDF) 22 Page - National Semiconductor (TI) |
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LM2672 Datasheet(HTML) 22 Page - National Semiconductor (TI) |
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22 / 25 page ![]() Application Information (Continued) LLP Package Devices The LM2672 is offered in the 16 lead LLP surface mount package to allow for increased power dissipation compared to the SO-8 and DIP. For details on thermal performance as well as mounting and soldering specifications, refer to Appli- cation Note AN-1187. www.national.com 22 |
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