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LAW57B Datasheet(PDF) 11 Page - OSRAM GmbH |
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LAW57B Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 15 page  LA W57B, LY W57B 2006-07-19 11 Empfohlenes Lötpaddesign 8) Seite 15 IR-Reflow Löten Recommended Solder Pad 8) page 15 IR Reflow Soldering Thermal enhanced PCB Thermisch optimiertes PCB 3 Lötstellen 3 solder points 1.6 (0.063) 11.6 (0.457) ø4.0 (0.157) Heatsink attach 11.6 (0.457) 12.0 (0.472) ø4.0 (0.157) ø2.5 (0.098) Kupfer Copper 1.6 (0.063) OHAY0681 Solder paste stencil Lötpasten Schablone Lötstopplack Solder resist Bare Copper Freies Kupfer Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Kathode und Heatsink sind elektrisch verbunden Attention: Cathode and Heatsink are electrically connected |
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