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DIA20721 Datasheet(PDF) 6 Page - DIOO MICROCIRCUITS CO., LTD |
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DIA20721 Datasheet(HTML) 6 Page - DIOO MICROCIRCUITS CO., LTD |
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6 / 15 page ![]() DIA2072X Version 1.6, Sep 2025 www.dioo.com © 2025 Dioo Microcircuits Co., Ltd. Jiangsu 3 5. Thermal Considerations The thermal resistance determines the heat insulation property of a material. The higher the thermal resistance is, the lower the heat loss. Accumulation of heat energy degrades the performance of semiconductor components. Symbol Metric Value Unit RθJA Junction-to-ambient thermal resistance MSOP8 146 °C/W RθJB Junction-to-board thermal resistance 95 °C/W RθJC Junction-to-case thermal resistance 62 °C/W |
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