TMS320DM647_0804 datasheet(7/182 Pages) TI

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Device Overview

2.1 Device Characteristics

TMS320DM647/TMS320DM648

Digital Media Processor

www.ti.com

SPRS372B – MAY 2007 – REVISED APRIL 2008

Table 2-1, provides an overview of the TMS320DM647/TMS320DM648 DSP. The tables show significant

features of the DM647/DM648 devices, including the capacity of on-chip RAM, the peripherals, the CPU

frequency, and the package type with pin count.

Table 2-1. Characteristics of the DM647/DM648 Processor

HARDWARE FEATURES

DM647

DM648

DDR2 memory controller (32-bit bus

width) [1.8 V I/O]

16-bit bus width

synchronous/asynchronous EMIF

[EMIFA]

EDMA3 (64 independent channels,

8 QDMA channels)

4 64-bit General Purpose

Timers

(each configurable as 1 64-bit or 2

32-bit)

UART

(with RTS and CTS flow control)

Peripherals

I2C

1 (Master/Slave)

Not all peripheral

SPI

1 (4-wire, 2 chip select)

pins are available

at the same time

McASP

1 (10 serializers)

(For more detail,

3-port Ethernet Switch Subsystem

see Section 3.)

supporting 10/100/1000 Base-T

1 SGMII port available

2 SGMII ports available

Management data input/output

(MDIO)

VLYNQ

General-purpose input/output port

Up to 32 pins

(GPIO)

HPI (16/32-bit)

PCI (32 bit) (33 MHz or 66 MHz)

1 (PCI33 or PCI66)

VIC

Configurable video ports

Size (bytes)

320KB RAM, 64KB ROM

576KB RAM, 64KB ROM

32KB L1 program (L1P)/cache (up to

32KB)

32KB L1 data (L1D)/cache (up to

On-Chip Memory

Organization

32KB L1 data (L1D)/cache (up to 32KB)

32KB)

256KB unified mapped RAM/Cache (L2)

512 KB unified mapped RAM/Cache

64KB Boot ROM

(L2)

64KB Boot ROM

Revision ID Register

MegaModule

(MM_REVID[15:0])

0x0003

Rev ID

(address location 0x0181 2000)

CPU ID + CPU

Control Status Register

0x1000

Rev ID

(CSR.[31:16])

JTAGID register

JTAG BSDL_ID

0x1B77 A02F

(address location: 0x0204 9018)

CPU Frequency

MHz

720, 900

Cycle Time

1.39 ns (-720), 1.11 ns (-900)

Core (V)

1.2 V (-720, 900)

Voltage

I/O (V)

1.8 V, 3.3 V

PLL Options

CLKIN1 frequency multiplier

x1 (Bypass), x15, x20, x25, x30, x32

BGA Package

529-Pin Flip Chip Plastic BGA (ZUT)

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Device Overview

TMS320DM647_0804 Datasheet(PDF) 7 Page - Texas Instruments

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