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M58MR032D Datasheet(PDF) 23 Page - STMicroelectronics

Part # M58MR032D
Description  32 Mbit 2Mb x16, Mux I/O, Dual Bank, Burst 1.8V Supply Flash Memory
PDF  52 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M58MR032D Datasheet(HTML) 23 Page - STMicroelectronics

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M58MR032C, M58MR032D
POWER CONSUMPTION
Power-down
The memory provides Reset/Power-down control
input RP. The Power-down function can be acti-
vated only if the relevant Read Configuration Reg-
ister bit is set to ’1’. In this case, when the RP
signal is pulled at VSS the supply current drops to
typically ICC2 (see Table 26), the memory is dese-
lected and the outputs are in high impedance. If
RP is pulled to VSS during a Program or Erase op-
eration, this operation is aborted and the memory
content is no longer valid (see Reset/Power-down
input description).
Power-up
The memory Command Interface is reset on Pow-
er-up to Read Array. Either E or W must be tied to
VIH during Power-up to allow maximum security
and the possibility to write a command on the first
rising edge of W. At Power-up the device is config-
ured as:
– Page mode: (CR15 = 1)
– Power-down disabled: (CR10 = 0)
– BINV disabled: (CR14 = 0).
All blocks are protected and unlocked.
VDD, VDDQ and VPP are independent power sup-
plies and can be biased in any order.
Supply Rails
Normal precautions must be taken for supply volt-
age decoupling; each device in a system should
have the VDD rails decoupled with a 0.1µF capac-
itor close to the VDD, VDDQ and VSS pins. The PCB
trace widths should be sufficient to carry the re-
quired VDD program and erase currents.



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