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M7040N Datasheet(PDF) 151 Page - STMicroelectronics |
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M7040N Datasheet(HTML) 151 Page - STMicroelectronics |
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151 / 159 page ![]() 151/159 M7040N Table 56. PBGA-ZA – 388-ball Plastic Ball Grid Array Package Mechanical Data Note: 1. The terminal “b” corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature of package body or integral heatslug. 2. A distinguished feature is allowable on the bottom surface of the package to identify the terminal “b” corner. 3. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di- ameter. 4. Exact shape of each corner is optional. Symb mm inches Typ Min Max Typ Min Max A 2.33 2.20 2.46 0.095 0.090 0.100 A2 0.56 0.022 b(1,2) 0.75 0.60 0.90 0.031 0.024 0.037 D(3,4) 35.00 34.80 35.20 1.429 1.420 1.437 D1 31.75 1.296 D2 30.00 1.224 E(3,4) 35.00 34.80 35.20 1.429 1.420 1.437 e 1.27 0.050 E1 31.75 1.296 E2 30.00 1.224 n 388 388 Tolerance Tolerance ddd 0.15 0.006 eee 0.30 0.012 fff 0.15 0.006 |
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