THERMAL CHARACTERISTICS

TYPICAL CHARACTERISTIC CURVES

1

1.05

1.1

1.15

1.2

1.25

1.3

1.35

1.4

-40

-25

-10

5

20

35

50

65

80

95

110

125

T -Free-AirTemperature- C

A

°

5VV

th+

3.3VV

th+

5VV

th-

3.3VV

th-

AirFlowat7cf/m,

Low-KBoard

2

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3

-40

-25

-10

5

20

35

50

65

80

95

110

125

T -Free-AirTemperature- C

A

°

V

fs+

V

fs-

V

at5Vor3.3V,

Load=15pF,

AirFlowat7/cf/m,

Low-KBoard

CC

0

5

10

15

20

25

30

35

40

45

50

0

1

2

3

4

5

V -OutputVoltage-V

O

V

=5V

CC

V

=3.3V

CC

Load=15pF,

T =25 C

A

°

0

10

20

30

40

50

0

2

4

6

V -OutputVoltage-V

O

V

=5V

CC

V

=3.3V

CC

Load=15pF,

T =25 C

A

°

ISO7230A

ISO7231A

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

INPUT THRESHOLD VOLTAGE

vs

vs

FREE-AIR TEMPERATURE

FREE-AIR TEMPERATURE

Figure 5.

Figure 6.

HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT CURRENT

vs

vs

HIGH-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT VOLTAGE

Figure 7.

Figure 8.

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11

Product Folder Link(s): ISO7230A ISO7231A