THERMAL METRIC(1)

DRV8804

UNIT

DW (SOIC)

PWP

(HTSSOP)

DYZ (SOT -23

THN)

20 PINS

16 PINS

16 PINS

ψJT

Junction-to-top characterization parameter

8.2

0.7

8.2

°C/W

ψJB

Junction-to-board characterization parameter

34.9

20.1

22.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

2.3

9.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

DRV8804

SLVSAW4G – JULY 2011 – REVISED DECEMBER 2024

www.ti.com

8

Submit Document Feedback

Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: DRV8804