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AS1109

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD to GND

-0.3

7

V

Input Voltage

-0.4

VDD + 0.4

V

Output Voltage

-0.4

15

V

GND Pin Current

1000

mA

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

ΘJA

33

ºC/W

on PCB, 16-pin SOIC-150 package

113

ºC/W

on PCB, 16-pin QSOP-150 package

32

ºC/W

on PCB, 16-pin QFN (4x4mm) package

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

QFN and QSOP

1

Represents a maximum floor life time of unlimited

Moisture Sensitive

Layer (SOIC)

3

Represents a maximum floor life of 168h