6.5 Thermal Information OPA2620

THERMAL METRIC(1)

OPA2620

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

150

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

68.2

°C/W

RθJB

Junction-to-board thermal resistance

87

°C/W

ψJT

Junction-to-top characterization parameter

9.4

°C/W

ψJB

Junction-to-board characterization parameter

86.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA620, OPA2620

SLOSEG2A – APRIL 2026 – REVISED JUNE 2026

www.ti.com

6

Submit Document Feedback

Copyright © 2026 Texas Instruments Incorporated

Product Folder Links: OPA620 OPA2620