6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

VIN

-0.3

20

V

Enable voltage

EN

-0.3

VIN

V

Output voltage

VREF

-0.3

VIN

V

Output short circuit current

ISC

25

mA

Operating temperature range

TA

-55

150

°C

Storage temperature range

Tstg

-65

170

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

± 1000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

± 500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

VREF + VDO (1)

18

V

EN

Enable voltage

0

VIN

V

NR

Noise reduction

0

6

V

IL

Output current

–10

10

mA

TA

Operating ambient temperature

–40

25

125

°C

(1)

VDO = Dropout voltage.

6.4 Thermal Information

THERMAL METRIC(1)

REF54

UNIT

FKH (LCCC)

D (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

86.7

120.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50.4

52

°C/W

RθJB

Junction-to-board thermal resistance

49

66

°C/W

ΨJT

Junction-to-top characterization parameter

39.8

9.8

°C/W

ΨJB

Junction-to-board characterization parameter

15.8

64.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

REF54

SNVSCN7D – NOVEMBER 2023 – REVISED JUNE 2026

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