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RX671 Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # RX671
Description  Renesas MCUs
PDF  179 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX671 Datasheet(HTML) 1 Page - Renesas Technology Corp

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RX671 Group
Renesas MCUs
Datasheet
R01DS0373EJ0120 Rev.1.20
Page 1 of 179
Sep 30, 2024
Features
■ 32-bit RXv3 CPU core
 Maximum operating frequency: 120 MHz
Capable of 707 CoreMark in operation at 120 MHz
 Double-precision 64-bit IEEE-754 floating point
 A collective register bank save function is available.
 Supports the memory protection unit (MPU)
 JTAG and FINE (one-line) debugging interfaces
■ Low-power design and architecture
 Operation from a single 2.7- to 3.6-V supply
 Battery supply of backup power allows continued operations of the
RTC and the backup registers.
 Four low-power modes
■ On-chip code flash memory
 Supports versions with up to 2 Mbytes of ROM
 No wait cycles at up to 60 MHz or when the ROM cache is hit, one-
wait state at up to 120 MHz
 User code is programmable by on-board or off-board programming.
 Programming/erasing as background operations (BGOs)
 A dual-bank structure allows exchanging the start-up bank.
■ On-chip data flash memory
 8 Kbytes, reprogrammable up to 100,000 times
 Programming/erasing as background operations (BGOs)
■ On-chip SRAM
 384 Kbytes of SRAM (no wait states)
 4 Kbytes of standby RAM (backup on deep software standby)
■ External address space
 Buses for full-speed data transfer (maximum operating frequency of
60 MHz)
 8 CS areas
 8- or 16-bit bus space is selectable per area
 Independent SDRAM area (128 Mbytes)
■ Data transfer
 DMACAb: 8 channels
 DTCb: 1 channel
 EXDMACa: 2 channels
■ Reset and supply management
 Power-on reset (POR)
 Low voltage detection (LVD) with voltage settings
 Backup domain low power detection
■ Clock functions
 External crystal resonator or internal PLL for operation at 8 to 24
MHz
 A sub-clock oscillator connectable to a 32.768-kHz crystal resonator
 Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20
MHz
 120-kHz clock for the IWDTa
■ Real-time clock
 Adjustment functions (30 seconds, leap year, and error)
 Real-time clock counting and binary counting modes are selectable
 Time capture in response to an event-signal input
■ Independent watchdog timer
 Operates with the 120-kHz clock frequency generated by the
dedicated low-speed oscillator
■ Useful functions for IEC60730 compliance
 Oscillation-stoppage detection, frequency measurement, CRCA,
IWDTa, self-diagnostic function for the A/D converter, etc.
 Register write protection function that protects important registers
against overwriting
■ Remote control signal receiver
■ Various communications interfaces
 PHY layer (up to 2 channels) for host/function or OTG controller
(1 channel) with full-speed USB 2.0 transfer
 CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up
to 2 channels)
 SCIk and SCIh with multiple functionalities (up to 13 channels)
Choose from among asynchronous mode, clock-synchronous mode,
smart-card interface mode, simplified SPI, simplified I2C, and
extended serial mode.
 SCIm with 16-byte transmission and reception FIFOs (up to 2
channels)
 Up to two RSCIs with Manchester encoding and HBS functionality
 The I2C bus interfaces RIIC and RIICHS for transfer at up to 3.4
Mbps (up to 3 channels), and the RIICHS also supports high-speed
mode.
 Single I/O RSPId (3 channels), single I/O RSPIA (1 channel), and
quad QSPIX (1 channel). The QSPIX supports fetching from serial
flash memory.
 SD host interface (1 channel) with a 1- or 4-bit SD bus for use with
SD memory or SDIO
 Serial sound interface supporting various audio data formats,
including I2S
■ Up to 25 extended-function timers
 16-bit TPUa, MTU3a
 8-bit TMRb (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2
channels)
■ 12-bit A/D converter
 Two 12-bit units (8 channels for unit 0; 12 channels for unit 1)
 Self diagnosis, detection of analog input disconnection
■ Temperature sensor for measuring temperature
within the chip
■ Capacitive touch sensing unit
 Self-capacitance method: A single pin configures a single key,
supporting up to 17 keys
 Mutual capacitance method: Matrix configuration with 17 pins,
supporting up to 64 keys
■ Encryption function
 Trusted Secure IP (TSIP)
AES128/192/256, TDES, ARC4, RSA, ECC,
True-random number generator (TRNG), SHA1, SHA224, SHA256,
MD5, GHASH, Prevention of the illicit copying of keys
■ Up to 114 pins for general I/O ports
 5-V tolerance, open drain, input pull-up, switchable driving ability
■ Operating temp. range
 D-version: –40C to +85C
 G-version: –40C to +105C
PLQP0144KA-B 20 × 20 mm, 0.50-mm pitch
PLQP0100KB-B 14 × 14 mm, 0.50-mm pitch
PLQP0064KB-C 10 × 10 mm, 0.50-mm pitch
PTLG0145JC-A 9 × 9 mm, 0.65-mm pitch
PTLG0145KB-A 7 × 7 mm, 0.50-mm pitch
PTLG0100JB-A 7 × 7 mm, 0.65-mm pitch
PTBG0064KB-A 4.5 × 4.5 mm, 0.50-mm pitch
PWQN0048KC-A 7 × 7 mm, 0.50-mm pitch
120-MHz 32-bit RX MCU, on-chip double-precision FPU, 707 CoreMark,
up to 2-MB flash memory (supporting the dual bank function), 384-KB SRAM,
various communications interfaces, including SD host interface, Quad SPI, and CAN, Capacitive touch sensing unit,
12-bit A/D converter, RTC, Encryption function, Serial sound interface, Remote control signal receiver
R01DS0373EJ0120
Rev.1.20
Sep 30, 2024
Features


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