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MICRF113 Datasheet(PDF) 14 Page - Micrel Semiconductor |
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MICRF113 Datasheet(HTML) 14 Page - Micrel Semiconductor |
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14 / 20 page ![]() Micrel, Inc. MICRF113 June 2008 14 M9999-060208 (408) 944-0800 R7, Ω Output Power, dBm IDD, mA 0 10 6.7 75 8.5 6.3 100 8.0 6.2 500 1.6 4.13 1000 -3.8 4.87 Output Power Versus External Resistor at 315MHz R7, Ω Output Power, dBm IDD, mA 0 8.68 7.5 75 8.34 7.33 100 8.02 7.3 500 4.34 6.3 1000 0.42 5.5 Output Power Versus External Resistor at 433.92 MHz Output Power ON-OFF Control There are two ways to enable the PA output power. First, by supplying the ASK signal with VDD applied continuously, resulting in a Mark and Space RF output condition. A second method involves applying both VDD and ASK synchronously. The second method allows for longer battery usage since the battery is disconnected during non-activation. Figure 7 shows the RF output time response since VDD and the ASK are applied to the MICRF113. The RF output response, as a function of VDD, is typically less then 1.25mSec. This measurement was done using the circuitry shown in Figure 2. Note: The ASK signal should never be applied before VDD. RF Output Response as a Function of VDD and ASK Figure 7. RF Output Response (VDD and ASK) Output Matching Network Part of the function of the output network is to attenuate the second and third harmonics. When matching to a transmit frequency, care must be taken both to optimize for maximum output power, and to attenuate unwanted harmonics. Layout Issues PCB Layout is a primary concern for achieving optimum performance and consistent manufacturing results. Care must used with the orientation of components to ensure that they do not couple or decouple the RF signal. PCB trace length should be short to minimize parasitic inductance (1 inch ~ 20nH). For example, depending upon inductance values, a 0.5 inch trace can change the inductance by as much as 10%. To reduce parasitic inductance, the practice of using wide traces and a ground plane under the signal traces is recommended. Vias with low value inductance should be used for components requiring a connection-to-ground. Antenna Layout Directivity is affected by antenna trace layout. No ground plane should be under the antenna trace. For consistent performance, components should not be placed inside the loop of the antenna. Gerber formats (see Figure 8, for a suggested layout) can be obtained from the Micrel web site at: http://www.micrel.com. |
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