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STN3NF06L Datasheet(PDF) 3 Page - STMicroelectronics |
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STN3NF06L Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 12 page ![]() STN3NF06L Electrical ratings 3/12 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 60 V VGS Gate-source voltage ± 16 V ID (1) 1. Current limited by the package Drain current (continuous) at TC = 25 °C 4 A ID Drain current (continuous) at TC=100 °C 2.9 A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 16 A PTOT Total dissipation at TC = 25 °C 3.3 W Derating factor 0.026 W/°C dv/dt (3) 3. ISD ≤3 A, di/dt ≤150 A/µs, VDD ≤ V(BR)DSS, TJ ≤ TJMAX Peak diode recovery voltage slope 10 V/ns EAS (4) 4. Starting Tj = 25 °C, ID = 4 A, VDD = 30 V Single pulse avalanche energy 200 mJ TJ Tstg Operating junction temperature Storage temperature -55 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit Rthj-pcb Thermal resistance junction-PCB(1) max 1. When Mounted on FR-4 board with 1 inch2 pad, 2 oz. of Cu. and t <10 sec. 38 °C/W Rthj-pcb Thermal resistance junction-PCB(2) max 2. When mounted on minimum recommended footprint 100 °C/W Tl (3) 3. for 10 sec. 1.6 mm from case Maximum lead temperature for soldering purpose typ 260 °C |
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