X006 datasheet(3/9 Pages) STMICROELECTRONICS

3 / 9 page

X006

Characteristics

3/9

Table 3.

Thermal resistances

Symbol

Parameter

Value

Unit

Rth(j-a)

Junction to ambient (DC)

TO-92

150

°C/W

S = 5 cm2

SOT-223

Rth(j-l)

Junction to lead (DC)

TO-92

Rth(j-t)

Junction to tab (DC)

SOT-223

Figure 1.

Maximum average power

dissipation versus average on-state

current

Figure 2.

Average and DC on-state current

versus case temperature (TO-92)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.0

0.1

0.2

0.3

0.4

0.5

0.6

P(W)

(A)

T(AV)

α = 180°

360°

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

100

125

(A)

T(AV)

T (°C)

α = 180°

D.C.

TO-92

Figure 3.

Average and D.C. on-state current

versus ambient temperature (epoxy

printed circuit board FR4, copper

thickness = 35 µm, SCU = 0.5 cm

(TO-92)

Figure 4.

Average and DC on-state current

versus case temperature (SOT-223)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

100

125

(A)

T(AV)

(°C)

amb

α = 180°

D.C.

TO-92

= 0.5 cm

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

100

125

(A)

T(AV)

(°C)

tab

α = 180°

D.C.

SOT-223

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