LPC1111FHN33SLASH201 datasheet(4/127 Pages) NXP

4 / 127 page

LPC111X

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Product data sheet

Rev. 9.2 — 26 March 2014

4 of 127

NXP Semiconductors

LPC1110/11/12/13/14/15

32-bit ARM Cortex-M0 microcontroller

LPC1112FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1112FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1112FHN24/202

HVQFN24

HVQFN24: plastic thermal enhanced very thin quad flat package; no

leads; 24 terminals; body 4 x 4 x 0.85 mm

SOT616-3

LPC1112FHI33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 5

 5  0.85 mm

n/a

LPC1112FHI33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 5

 5  0.85 mm

n/a

LPC1112FHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 5

 5  0.85 mm

n/a

LPC1112JHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 5

 5  0.85 mm

n/a

LPC1112FHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1112JHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1112JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1112FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113FHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1113JHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1114FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1114FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1114FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

LPC1114FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no

leads; 33 terminals; body 7

 7  0.85 mm

n/a

Table 1.

Ordering information …continued

Type number

Package

Name

Description

Version

LPC1111FHN33/201 Datasheet(PDF) 4 Page - NXP Semiconductors

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