AXICOM

Telecom-, Signal and RF Relays

HF3 Relay

108-98000 Rev. C

All specifications subject to change. Consult Tyco Electronics for latest specifications.

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Vapor Phase Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

240 °C

180 °C

130 °C

100 °C

external preheating

Full line:

typical

Dotted line: process limits

forced

cooling

Time (s)

Recommended reflow soldering profile

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

Time (s)

Recommended Soldering Conditions

Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B

20 - 40 sec

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

Time (s)

Resistance to soldering heat - Reflow profile