-6-

· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.

Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist

and warpage of the board.

When mechanical stress from the board affects the soldered LED, place the LED in the preferable

location and orientation as shown above.

· Depending on the position and direction of LED, the mechanical stress on the LED package can be

changed. Refer to the following figure.

Perforated line

Slit

Stress : A > B = C > D > E

· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.

Hand brake without these tools and equipment may not be used.

· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and

subsequently may result in solder joint crack. Users may need to evaluate their specific application to

determine any impact due to the use of aluminum substrate.

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Ａ

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Ｂ

【

Non-preferable】

【

Preferable】

Cathode mark

Cathode mark

Nichia STS-DA1-0147

<Cat.No.080319>