ABSOLUTE MAXIMUM RATINGS

(1) (2)

DISSIPATION RATINGS

TLC5947

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

ORDERING NUMBER

TRANSPORT MEDIA, QUANTITY

TLC5947DAPR

Tape and Reel, 2000

TLC5947

HTSSOP-32 PowerPAD™

TLC5947DAP

Tube, 46

TLC5947RHBR

Tape and Reel, 3000

5-mm × 5-mm QFN-32

TLC5947RHB

Tape and Reel, 250

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Shaded cells indicate product preview device.

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

TLC5947

UNIT

–0.3 to +6.0

V

Output current (dc)

OUT0 to OUT23

38

mA

Input voltage range

SIN, SCLK, XLAT, BLANK

V

SOUT

V

Output voltage range

OUT0 to OUT23

–0.3 to +33

V

Operating junction temperature

+150

°C

Storage temperature range

–55 to +150

°C

Human body model (HBM)

2

kV

ESD rating

Charged device model (CDM)

500

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

All voltage values are with respect to network ground terminal.

OPERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

HTSSOP-32 with

42.54 mW/°C

5318 mW

3403 mW

2765 mW

HTSSOP-32 with

22.56 mW/°C

2820 mW

1805 mW

1466 mW

27.86 mW/°C

3482 mW

2228 mW

1811 mW

(1)

With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available

for download at www.ti.com).

(2)

With PowerPAD not soldered onto copper area on PCB.

(3)

The package thermal impedance is calculated in accordance with JESD51-5.

2

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