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STD35NF3LL Datasheet(PDF) 2 Page - STMicroelectronics |
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STD35NF3LL Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 10 page ![]() STD35NF3LL/STD35NF3LL-1 2/10 THERMAL DATA ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified) OFF ON (*) DYNAMIC Rthj-case Rthj-amb Tl Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose Max Max Typ 3 100 300 °C/W °C/W °C Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 30 V IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating TC = 100°C 1 10 µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 16 V ±100 nA Symbol Parameter Test Conditions Min. Typ. Max. Unit VGS(th) Gate Threshold Voltage VDS = VGS ID = 250 µA 1V RDS(on) Static Drain-source On Resistance VGS = 10 V ID = 17.5 A VGS = 4.5 V ID = 17.5 A 0.014 0.016 0.0195 0.0215 Ω Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (*) Forward Transconductance VDS =15 V ID = 17.5 A 19 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V, f = 1 MHz, VGS = 0 800 250 60 pF pF pF |
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