10-18GHz LNA VGA

CHA2291

Ref. : DSCHA22917165 - 14 Jun 07

7/8

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Chip Assembly and Mechanical Data

To V5 DC drain supply feed

To Vd2,3,4 DC drain supply feed

To Vg1 DC gate supply feed

To Vg2,3,4 DC gate supply feed

To Vc DC supply feed

120pF

120pF

120pF

120pF

120pF

RF IN

RF OUT

Note:

Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended

Bond Pad: 100 x 100 µm

Bonding pad positions

( Chip thickness : 100µm. All dimensions are in micrometers )