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CHA2292 Datasheet(PDF) 6 Page - United Monolithic Semiconductors |
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CHA2292 Datasheet(HTML) 6 Page - United Monolithic Semiconductors |
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6 / 7 page ![]() 17-24GHz LNA VGA CHA2292 Ref. : DSCHA22927150 - 20 May 07 6/7 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Assembly and Mechanical Data Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended Bond Pad:100 x 100 µm Bonding pad positions ( Chip thickness : 100µm. All dimensions are in micrometers ) 234 234 |
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