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STE70NM50 Datasheet(PDF) 3 Page - STMicroelectronics |
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STE70NM50 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() 3/8 STE70NM50 ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. GATE-SOURCE ZENER DIODE PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the 25V Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) Turn-on Delay Time VDD = 250V, ID = 30A RG = 4.7Ω VGS = 10V (see test circuit, Figure 3) 51 ns tr Rise Time 58 ns Qg Total Gate Charge VDD = 400V, ID = 60A, VGS = 10V 190 266 nC Qgs Gate-Source Charge 53 nC Qgd Gate-Drain Charge 97 nC Symbol Parameter Test Conditions Min. Typ. Max. Unit tr(Voff) Off-voltage Rise Time VDD = 400V, ID = 60A, RG = 4.7Ω, VGS = 10V (see test circuit, Figure 5) 51 ns tf Fall Time 46 ns tc Cross-over Time 108 ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 60 A ISDM (2) Source-drain Current (pulsed) 240 A VSD (1) Forward On Voltage ISD = 60A, VGS = 0 1.5 V trr Qrr Irrm Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 60A, di/dt = 100A/µs, VDD = 100 V, Tj = 25°C (see test circuit, Figure 5) 532 9.9 37 ns µC A trr Qrr Irrm Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 60A, di/dt = 100A/µs, VDD = 100 V, Tj = 150°C (see test circuit, Figure 5) 636 13.4 42 ns µC A Symbol Parameter Test Conditions Min. Typ. Max. Unit BVGSO Gate-Source Breakdown Voltage Igs=± 1mA (Open Drain) 30 V |
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