STLVDS32B datasheet(7/17 Pages) STMICROELECTRONICS

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STLVDS32B

Electrical characteristics

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Note:

tsk(O) is the maximum delay time difference between the propagation delay of one channel

and that of the others on the same chip with any event on the inputs.

2tsk(P) is the magnitude difference in differential propagation delay time between the positive

going edge and the negative going edge of the same channel.

3tsk(PP) is the differential channel-to-channel skew of any event between devices. This

specification applies to devices at the same VCC, and within 5°C of each other within the

operating temperature range

Table 7.

Switching characteristics

(Over recommended operating conditions unless otherwise noted. All typical values are at

TA = 25°C, and VCC = 3.3 V).

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

tPLH

Propagation delay time, low to

high output

CL = 10 pF, Figure 3.

1.5

2.5

3.3

tPHL

Propagation delay time, high to

low output

1.5

2.5

3.3

Output signal rise time

0.4

Output signal fall time

0.4

tsk(O)

Channel to channel output skew

(Note: 1)

0.1

0.3

tsk(P)

Pulse skew (|tPHL - tPLH|) (Note 2)0.2

0.4

tsk(PP)

Part to part skew (Note 3)1

tPZH

Propagation delay time, high

impedance to high level output

Figure 4.

312

tPZL

Propagation delay time, high

impedance to low level output

512

tPHZ

Propagation delay time, high level

to high impedance output

512

tPLZ

Propagation delay time, low level

to high impedance output

512

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