ESDAULC6-3BP6, ESDAULC6-3BF2

Package information

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Figure 25.

Flip-Chip dimensions

Figure 28.

Flip-Chip tape and reel specifications

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 26.

Flip-Chip footprint

Figure 27.

Flip-Chip marking

1.1 mm ± 50 µm

315 µm ± 50

500 µm ± 50

650 µm ± 65

Copper pad Diameter:

220 µm recommended

Solder stencil opening:

330 µmrecommended

Solder mask opening recommendation:

300 µmrecommended

x

y

x

w

z

w

E

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.71 +/- 0.05