ESDAULC6-3BF2 datasheet(1/11 Pages) STMICROELECTRONICS

Part #	ESDAULC6-3BF2

Description	ESD protection for high speed interface

PDF	11 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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1 / 11 page

July 2007

Rev 1

1/11

11

ESDAULC6-3BP6

ESDAULC6-3BF2

ESD protection for high speed interface

Main applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

■ Computers

■ Printers

■ Communication systems

■ Cellular phones handsets and accessories

■ Video equipment

Features

■ Ultra low capacitance 1.25 pF max.

■ Bi-directional protection

■ RoHS package

Description

The ESDAULC6-3Bxx is a monolithic application

specific discrete device dedicated to ESD

protection of high speed interfaces such as

USB2.0.

The device is ideal for applications where both

reduced print circuit board space and power

absorption capability are required.

Benefits

■ Ultra low capacitance bidirectional ESD

protection

■ Low PCB space consumption:

2.5 mm2 max footprint (1.7 mm2 for Flip-Chip)

■ Enhanced ESD protection:

– 15 kV contact discharge

– 15 kV air discharge

■ No insertion loss to 3.0 GHz

■ Ultra low leakage current

■ High reliability offered by monolithic integration

Figure 1.

Functional diagram

Figure 2.

Pin configuration

Complies with the following standards:

Table 1.

Order codes

Part number

Marking

ESDAULC6-3BP6

3

ESDAULC6-3BF2

3B

IEC 61000-4-2 level 4:

8 kV (contact discharge)

15 kV (air discharge)

MIL STD 883G-Method 3015-7: class 3B

HBM (Human Body Model)

SOT-666

ESDAULC6-3BP6

Flip-Chip

ESDAULC6-3BF2

I/O1

I/O2

GND

NC

I/O3

1

2

34

5

6

B

1

2

A

I/O2

I/O3

I/O1

GND

Top view

ESDAULC6-3BP6

Bump side view

ESDAULC6-3BF2

GND

I/O1

I/O2

I/O3

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