EMIF04-1502QCF

4/6

Figure 9: QFN Package Mechanical Data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

A3

b

b1

E2

k

D2

D

m

m

L

E

e

See detail A

See detail B

Detail B

Detail A

A

A1

L1

L2

L1

L2

Figure 10: Foot Print dimensions

(in millimeters)

Figure 11: Package marking

0.98

1.01

0.33

0.56

0.89

0.28

0.50

3.00

0.34

F4

Dot on package indicates Pin 1

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max

Min.

Typ.

Max.

A

0.50

1.00 0.020

0.039

A1

0.00

0.03

0.05

0.00

0.001 0.002

A3

0.25

0.010

b

0.18

0.30 0.007

0.012

b1

0.17

0.44 0.007

0.017

D

1.90

2.00

2.10

0.079

D2

0.88

0.98

1.08 0.035 0.039 0.043

E

1.90

2.00

2.10

0.079

E2

0.46

0.56

0.65 0.018 0.022 0.026

e

0.50

0.020

L

0.20

0.29

0.45 0.008

0.018

L1

0.15

0.006

L2

0.13

0.005

k

0.20

0.008

m

0.12

0.17

0.23