EMIF06-VID01C2

Package information

5/7

Figure 9.

Flip-Chip Tape and reel specifications

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Note:

More packing informations are available in the application note

AN1235: “Flip-Chip: Package description and recommendations for use”

AN1751: “EMI Filters: Recommendations and measurements”

Figure 7.

Footprint recommendations

Figure 8.

Marking

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

Dot, ST logo

xx = marking

yww = date code

(y = year

ww = week)

z = manufacturing location

x

y

z

w

x

w

E

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.78 +/- 0.05