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TS2012EIJT Datasheet(PDF) 29 Page - STMicroelectronics |
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TS2012EIJT Datasheet(HTML) 29 Page - STMicroelectronics |
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29 / 31 page  TS2012FC Package information 29/31 Figure 44. Tape and reel schematics (top view) Figure 45. Recommended footprint User direction of feed 8 Die size X + 70µm 4 4 All dimensions are in mm A 1 A 1 User direction of feed 8 Die size X + 70µm 4 4 All dimensions are in mm A 1 A 1 150 μm min. 500 μm 500 μm Φ=250μm Φ=400μm typ. 75µm min. 100 μm max. Track Non Solder mask opening Φ=340μm min. Pad in Cu 18 μm with Flash NiAu (2-6μm, 0.2μm max.) 150 μm min. 500 μm 500 μm Φ=250μm Φ=400μm typ. 75µm min. 100 μm max. Track Non Solder mask opening Φ=340μm min. Pad in Cu 18 μm with Flash NiAu (2-6μm, 0.2μm max.) |
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