L6258EP datasheet(30/32 Pages) STMICROELECTRONICS

30 / 32 page

Package information

L6258EP

30/32

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 14.

PowerSSO36 mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

2.15

2.47

0.084

0.097

2.15

2.40

0.084

0.094

0.075

0.003

0.18

0.36

0.007

0.014

0.23

0.32

0.009

0.012

D (1)

10.10

10.50

0.398

0.413

E (1)

7.4

7.6

0.291

0.299

0.5

0.019

8.5

0.335

2.3

0.090

0.10

0.004

0.06

0.002

10.10

10.50

0.398

0.413

0.40

0.016

k5˚

5˚

0.55

0.90

0.022

0.035

4.3

0.169

10˚

1.2

0.047

0.8

0.031

2.9

0.114

T3.65

0.144

1.0

0.039

4.1

4.7

0.161

0.185

6.5

7.3

0.256

0.287

(1) "D” and “E" do not include mold flash or protrusions Mold flash

or protrusions shall not exceed 0.15 mm per side(0.006”)

PowerSSO-36

7587131 A

(slug-down)

LEAD COPLANARITY

BOTTOM VIEW

0.1

hx45û

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