Pad dimensions (in microns)/pad positions

STV7733

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Pad dimensions (in microns)/pad positions

The reference (x=0, y=0) is the center of the die. Bump pad pitch: 68 µm, minimum (on the

power output side of the die).

Pad placement coordinate values correspond to the center of each bump pad center.

Number of pads: 404

Table 8.

Die size

Dimension

Units

Die size without scribe

X

22440

µm

Y

1550

µm

Die size with scribe

X

22550

µm

Y

1660

µm

Table 9.

Pad placement and bump dimensions (in microns)

Lead pad name

Pad placements

X

Y

X

Y

OUT320

-10845.9

600.6

51.0

73.1

OUT319

-10777.9

600.6

51.0

73.1

OUT318

-10709.9

600.6

51.0

73.1

OUT317

-10641.9

600.6

51.0

73.1

OUT316

-10573.9

600.6

51.0

73.1

OUT315

-10505.9

600.6

51.0

73.1

OUT314

-10437.9

600.6

51.0

73.1

OUT313

-10369.9

600.6

51.0

73.1

OUT312

-10301.9

600.6

51.0

73.1

OUT311

-10233.9

600.6

51.0

73.1

OUT310

-10165.9

600.6

51.0

73.1

OUT309

-10097.9

600.6

51.0

73.1

OUT308

-10029.9

600.6

51.0

73.1

OUT307

-9961.9

600.6

51.0

73.1

OUT306

-9893.9

600.6

51.0

73.1

OUT305

-9825.9

600.6

51.0

73.1

OUT304

-9757.9

600.6

51.0

73.1

OUT303

-9689.9

600.6

51.0

73.1