VS6451R0BASLASHTR datasheet(2/4 Pages) STMICROELECTRONICS

2 / 4 page

VS6451

2/4

Figure 1.

Application diagram

Figure 2.

Block diagram

Table 1.

Technical specifications

Parameter

Values

Pixel array

CIF+ portrait and landscape

Sensor technology

0.18 µm HCMOS8i shrink

Pixel size

3.6µm x 3.6µm

Exposure control

+8 dB

Analogue gain

+24 dB (max)

Dynamic range

61 dB

Signal to noise

34 dB (@ 100 lux)

Minimum illumination

< 7lux

Supply voltage

Analogue: 2.4V to 2.9V

Digital: 1.8V ± 0.1V

Average power consumption @ 30fps

<60 mW

Module size (XYZ) max

4.5 mm x 4.5 mm x 3.55 mm

Lens HFOV

45°+/- 2° (CIF+, CIF equiv. 45°)

F number

2.8

Lens SFR

On axis 45% (typ)

Horizontal field (70%) 25% (typical)

Lens TV distortion

<|5%|

Relative illumination

60% (typ)

System connectivity

Lead free reflowable BGA

Storage temperature

[-40; +85]°C

Functional operating temperature

[-30; +70]°C

Normal operating temperature

[-25; +55]°C

Optimal operating temperature

[+5; +30]°C

Baseband

Application

Processor

CLK

PDN

CCI

CCP2.0

STV0984

STV0976

Processor

I2C

CCP2.0

CLK

PDN

CIF+

VS6451

CCI

Baseband

Application

Processor

CCP2.0

SMIA Rx’er

ITU

CLK

PDN

camera

module

CIF+

VS6451

camera

module

SCL

SDA

EXTCLK

CLKP

DATAP

DATAN

VANA

AGND

VDIG

DGND

1152 x 864

CIF+

Column ADC

X Decoder

Line SRAM

SMIA

profile 0

Sensor

Control

PLL and Clock Management

Power Mgmt

Power-On Reset

Pixel array

VS6451

CLKN

Registers

frame

formatter

XSHUTDOWN

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