Overview

VW6754

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1

Overview

Figure 1.

Application diagram

Figure 2.

Block diagram

Table 1.

Technical specifications

Parameter

Descriptions

Pixel resolution

1600 x 1200 (UXGA)

Sensor technology

ST IMG175 process

Pixel size

1.75 µm x 1.75 µm

Exposure control

+ 81 dB

Analog gain

+ 24 dB (max)

Dynamic range

60 dB

Signal to noise

37 dB (@ 100 lux)

1.

At minimum illumination the image is correctly exposed with D65 illumination on 18% grey card at 30fps

< 10 lux

Supply voltage

Analog: 2.4 V to 2.9 V

Digital: 1.7 V to 2.9 V

Average power consumption 30fps

<200 mW

Package size (lxwxh)

5.0 mm x 5.0 mm x 3.8 mm

Lens

51° +/- 2 HFOV

F/2.8

TV distortion

Typical <|1.0%|

2.

With anti-vignette function

Typical 50% +/-2%

Package type

BGA

System attach

Lead-free reflowable soldering process

Baseband

or

Application

Processor

CLK

PDN

CCI

CCP2.0

STV0984

or

STV0986

Processor

I2C

CCP2.0

CLK

PDN

2Mpixel

VW6754

CCI

Baseband

or

Application

Processor

CCP2.0

SMIA Rx’er

or

ITU

CLK

PDN

camera

module

2Mpixel

VW6754

camera

module

SCL

SDA

EXTCLK

CLKP

DATAP

DATAN

VANA

AGND

VDIG

DGND

1152 x 864

2Mpixel

Column ADC

X Decoder

Line SRAM

SMIA

profile 0

Sensor

Control

PLL and Clock Management

Power Mgmt

Power-On Reset

Pixel array

VW6754

CLKN

Registers

frame

formatter

XSHUTDOWN