TSOP362 datasheet(7/14 Pages) VISHAY

7 / 14 page

TSOP362..

Document Number 82187

Rev. 1.6, 23-Oct-06

Vishay Semiconductors

www.vishay.com

Assembly Instructions

Reflow Soldering

•

Reflow soldering must be done within 72 hours

while stored under a max. temperature of 30 °C, 60 %

RH after opening the dry pack envelope.

•

Set the furnace temperatures for pre-heating and

heating in accordance with the reflow temperature

profile as shown in the diagram. Excercise extreme

care to keep the maximum temperature below

260 °C. The temperature shown in the profile means

the temperature at the device surface. Since there is

a temperature difference between the component and

the circuit board, it should be verified that the temper-

ature of the device is accurately being measured.

•

Handling after reflow should be done only after the

work surface has been cooled off.

Manual Soldering

•

Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C.

•

Finish soldering within three seconds.

•

Handle products only after the temperature has

cooled off.

Vishay Leadfree Reflow Solder Profile

100

150

200

250

300

100

150

200

250

300

t [sec]

255 °C

240 °C

245 °C

max. 260 °C

max. 120 sec

max. 100 sec

217 °C

max. 20 s

max. Ramp Up 3 °C/sec

max. Ramp Down 6 °C/sec

max. 2 cycles allowed

19800

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