TL1963A datasheet(3/26 Pages) TI

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ABSOLUTE MAXIMUM RATINGS

(1)

PACKAGE THERMAL DATA

(1)

TL1963A-xx

www.ti.com ........................................................................................................................................................ SLVS719A – JUNE 2008 – REVISED AUGUST 2008

over operating free-air temperature range (unless otherwise noted)

–20 V to 20 V

OUT

–20 V to 20 V

Input-to-output differential(2)

–20 V to 20 V

VIN

Input voltage range

SENSE

–20 V to 20 V

ADJ

–7 V to 7 V

SHDN

–20 V to 20 V

tshort

Output short-circuit duration

Indefinite

Tlead

Maximum lead temperature

10-second soldering time

300°C

Operating virtual-junction temperature range

–40°C to 125°C

Tstg

Storage temperature range

–65°C to 150°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages.

With the IN pin at 20 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT cannot exceed ±20 V.

PACKAGE

BOARD

(2)

TO-263 (KTT)

High K, JESD 51-5

26.5°C/W

31.8°C/W

0.38°C/W

(1)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

(2)

For packages with exposed thermal pads, such as QFN, PowerPAD™, and PowerFLEX™,

JP is defined as the thermal resistance

between the die junction and the bottom of the exposed pad.

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