VIPER17HN datasheet(28/33 Pages) STMICROELECTRONICS

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Package mechanical data

VIPER17

28/33

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

1- The leads size is comprehensive of the thickness of the leads finishing material.

2- Dimensions do not include mold protrusion, not to exceed 0,25 mm in total (both side).

3- Package outline exclusive of metal burrs dimensions.

4- Datum plane “H” coincident with the bottom of lead, where lead exits body.

5- Ref. POA MOTHER doc. 0037880

6- Creepage distance > 800 V

7- Creepage distance 250 V

8- Creepage distance as shown in the 664-1 CEI / IEC standard.

Table 10.

DIP-7 mechanical data

Dim.

Typ

Min

Max

5,33

0,38

3,30

2,92

4,95

0,46

0,36

0,56

1,52

1,14

1,78

0,25

0,20

0,36

9,27

9,02

10,16

7,87

7,62

8,26

6,35

6,10

7,11

2,54

7,62

10,92

3,30

2,92

3,81

M (6)(8)

2,508

0,50

0,40

0,60

O (7)(8)

0,548

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